The heat source within a micro-chip structure can produce transient high temperatures, leading to significant thermal deformation and stress. We executed a Finite Element Analysis (FEA) transient thermal stress assessment on this micro-chip structure, determining the temperature, deflection, and stress distribution at various time instances. FEA thermal analysis is typically employed when the primary objective is to evaluate temperature distribution, thermal stress, or when the boundary conditions are clearly established.
Performed FEA transient thermal analysis on the multiple pan designs, obtain the temperature distribution at all time points. Compare the performance of different designs and provide suggestions to modify the design for better performance.
Contact Us if you would like to run FEA steady or transient thermal analysis.